[Product weight]：0.5g±0.02g
[Chip solution]：SX1268
[Working frequency band]：410MHz～493MHz
[Transmission power]：22dBm
[Communication distance]：7km
[Product size]：10*10*2.5mm
[Introduction]：E22-400MM22S is an ultra-small size and suitable for 433MHz and 470MHz SMD LoRaTM wireless module based on the new generation of LoRaTM RF chip SX1268 produced by Semtech in the United States as its core.
| mainly parameters | Performance | Notes | |||
| Min | Typical | Max | |||
| Power Supply Voltage（V） | 1.8 | 3.3 | 3.7 | ≥3.3V Can ensure the output power | |
| communication level（V） | - | 3.3 | - | Using 5V TTL may burn out | |
| Working temperature（°C） | -40 | - | 85 | Industrial grade design | |
| Working frequency band（GHz） | 410 | 433/470/490 | 493 | Support ISM Frequecy | |
| Power consumption | Emission current（mA） | - | 100 | - | instantaneous power consumption |
| Receives the current（mA） | - | 6.5 | - | - | |
| Sleep current（μA） | - | 2 | - | software shut off | |
| Maximum transmitted power（dBm） | 21.4 | 21.5 | 22.3 | - | |
| Sensitivity of reception（dBm） | -144 | -146 | -147 | air rate is 0.3kbps | |
| air rate（bps） | 0.6k | - | 300k | User programming control | |
| 0.018k | 62.5k | User programming control | |||
| mainly parameters | Description | Notes |
| Distance | 7000m | Clear and open environment, antenna gain 5dBi, antenna height 2.5m, air speed 0.3kbps. |
| FIFO | 256 Byte | Maximum sending length |
| Crystal frequency | 32 MHz | - |
| Modulation method | LoRa(recommend) | - |
| Encapsulation way | SMD | - |
| Interface | 1.27mm | Stamp hole |
| Communication interface | SPI | 0-10Mbps |
| Overall dimensions | 10* 10*2.5 mm | - |
| Antenna interface | Stamp hole/IPEX | The equivalent impedance is about 50 ohms |
| mainly parameters | Performance | Notes | |
| Min | Max | ||
| Power Supply Voltage（V） | 0 | 3.7 | Permanently burn module over 3.7V |
| Blocking power（dBm） | - | 10 | At close range, the burn probability is low |
| Operating temperature（°C） | -40 | 85 | - |
| Product net weight | 0.5g士0.02g | Product net weight | |
| Pin number | Pin name | Pin direction | Pin purposes |
| 1 | VCC | - | Power supply, range 1.8V~3.7V (external ceramic filter capacitor is recommended) |
| 2 | GND | - | Ground wire, connected to the power reference ground |
| 3 | NRST | input | Chip reset triggers input pin, active low level |
| 4 | NC | - | - |
| 5 | NC | - | - |
| 6 | ANT | - | Radio frequency interface, stamp hole |
| 7 | GND | - | Ground wire, connected to the power reference ground |
| 8 | NC | - | - |
| 9 | TXEN | input | Rf switch transmitting control pin, connected to external |
| 10 | RXEN | input | Rf switch receiving control pin, connected to external |
| 11 | BUSY | output | Used for status indication |
| 12 | MIS0 | output | SPI data output pin |
| 13 | M0SI | input | SPI data input pin |
| 14 | NSS | input | The module chip selection pin is used to start an SPI |
| 15 | SCK | input | SPI clock input pin |
| 16 | GND | - | Ground wire, connected to the power reference ground |
| 17 | NC | - | - |
| 18 | DI03 | Input/output | Configurable universal I/O port |
| 19 | DIO2 | Input/output | Configurable universal I/O port |
| 20 | DI01 | Input/output | Configurable universal I/O port |