LoRa

E22-400TBH-SC LoRa module development and test board

[Interface]:Type-C

[Size]:30*85mm

[Introduction]:The SC series evaluation kit is designed to help users quickly evaluate Ebyte's new generation of package-compatible wireless modules. The development board is soldered with the E22-400M22S model lora module, and the MCU uses the STM32F103C8T6. The available pins have been led out to the pin headers on both sides to facilitate developers to carry out secondary development. The kit provides complete software application examples to help customers quickly get started with wireless data communication development. Different types of Sub-1G wireless modules can be mounted on the board according to needs.

LORA module development and test board

LORA module development and test board

LORA module development and test board

LORA module development and test board

serial numberParameter nameParameter valueComment
1Test board size30*85mm-
2Production processLead-free process, machine-mountedMachine bonding ensures batch consistency and reliability
3Antenna interfaceSMA-
4Power supply interfaceType-CUSB to Type-C
5working temperature-40 ~ +85℃-
6Working humidity10%~90%-
7storage temperature-40 ~ +125℃-



pin
Pin numberdefinitionFunction description
1GNDBottom ground wire
2PA2MCU_PA2 pin
3PA1MCU_PA1 pin
4PA0MCU_PA0 pin
5NRSTMCU reset pin
6PC13MCU_PC13 pin
7VBATMCU_VBAT pin
8PB8MCU_PB8 pin
9GNDBottom ground wire
10+5V5V power supply interface
11GNDBottom ground wire
123.3V3.3V power supply interface
13CLKSWCLK
14PARTSWEDING
15TXDMCU_TXD data output pin
16RXDMCU_RXD data input pin
17PA8MCU_PA8 pin
18PB15MCU_PB15 pin
19PB14MCU_PB14 pin
20GNDBottom ground wire


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